fhÖÁ×ðµÇ¼

ÕÐÏÍÄÉÊ¿

È˲ÅÕÐƸ

2022-05-21 Sr. Mechanical Engineering ÉòÑô н³êÃæÒé
login_FHÖÁ×ð¡¸Ò»¼ÒÓа®µÄÓÎϷƽ̨¡¹ login_FHÖÁ×ð¡¸Ò»¼ÒÓа®µÄÓÎϷƽ̨¡¹

ְλÐÎò£º

Responsibilities

1.Establish requirements for semiconductor equipment systems and components
2.Organize, participate, and lead in the feasibility studies, conceptualization, modeling, analysis, development, documentation, and test/validation of hardware associated with new semiconductor equipment
3.Develop and present reports/presentations that communicate design intent, analysis, and validation at executive-level meetings.
4.Lead multi-disciplinary development teams, serve as an expert resource for a product or technical area, and directly support personnel in the preparation of detailed design, design testing and prototype fabrication
5. Analyze designs developed ¨C may need to perform structural analysis (FEA), thermal and fluid flow analysis, and Failure Modes and Effects Analysis (FMEA)
6. Lead problem solving teams including root cause identification, brainstorming and conceptual development
7.Work with potential suppliers to ensure parts can be manufactured in accordance with performance and cost objectives
8.Provide on-job training (OJT) for other engineers

Qualifications

1.Engineering background with thermal designs and/or RF system designs coupled with solid engineering skills
2.Minimum of 12 years related engineering experience with a Bachelor¡¯s degree; or 8 years and a Master¡¯s degree; or a PhD with 5 years¡¯ experience; or equivalent experience
3.Extremely knowledgeable using 3D-CAD tools, strong hands-on experimental and design capability
4.Excellent presentation skills; present progress on large cross-functional initiatives at executive-level meetings
5.Strong skills and experiences in problem solving, time and priority management, communication, and project management

Preferred Qualifications

Semiconductor industry experience is not required, but a plus.

2022-05-21 Sr. Mechanical Engineering ±±¾© н³êÃæÒé
login_FHÖÁ×ð¡¸Ò»¼ÒÓа®µÄÓÎϷƽ̨¡¹ login_FHÖÁ×ð¡¸Ò»¼ÒÓа®µÄÓÎϷƽ̨¡¹

ְλÐÎò£º

Responsibilities

1.Establish requirements for semiconductor equipment systems and components
2.Organize, participate, and lead in the feasibility studies, conceptualization, modeling, analysis, development, documentation, and test/validation of hardware associated with new semiconductor equipment
3.Develop and present reports/presentations that communicate design intent, analysis, and validation at executive-level meetings.
4.Lead multi-disciplinary development teams, serve as an expert resource for a product or technical area, and directly support personnel in the preparation of detailed design, design testing and prototype fabrication
5. Analyze designs developed ¨C may need to perform structural analysis (FEA), thermal and fluid flow analysis, and Failure Modes and Effects Analysis (FMEA)
6. Lead problem solving teams including root cause identification, brainstorming and conceptual development
7.Work with potential suppliers to ensure parts can be manufactured in accordance with performance and cost objectives
8.Provide on-job training (OJT) for other engineers

Qualifications

1.Engineering background with thermal designs and/or RF system designs coupled with solid engineering skills
2.Minimum of 12 years related engineering experience with a Bachelor¡¯s degree; or 8 years and a Master¡¯s degree; or a PhD with 5 years¡¯ experience; or equivalent experience
3.Extremely knowledgeable using 3D-CAD tools, strong hands-on experimental and design capability
4.Excellent presentation skills; present progress on large cross-functional initiatives at executive-level meetings
5.Strong skills and experiences in problem solving, time and priority management, communication, and project management

Preferred Qualifications

Semiconductor industry experience is not required, but a plus.

2022-05-21 Sr. Mechanical Engineering ÉϺ£ н³êÃæÒé
login_FHÖÁ×ð¡¸Ò»¼ÒÓа®µÄÓÎϷƽ̨¡¹ login_FHÖÁ×ð¡¸Ò»¼ÒÓа®µÄÓÎϷƽ̨¡¹

ְλÐÎò£º

Responsibilities

1.Establish requirements for semiconductor equipment systems and components
2.Organize, participate, and lead in the feasibility studies, conceptualization, modeling, analysis, development, documentation, and test/validation of hardware associated with new semiconductor equipment
3.Develop and present reports/presentations that communicate design intent, analysis, and validation at executive-level meetings.
4.Lead multi-disciplinary development teams, serve as an expert resource for a product or technical area, and directly support personnel in the preparation of detailed design, design testing and prototype fabrication
5. Analyze designs developed ¨C may need to perform structural analysis (FEA), thermal and fluid flow analysis, and Failure Modes and Effects Analysis (FMEA)
6. Lead problem solving teams including root cause identification, brainstorming and conceptual development
7.Work with potential suppliers to ensure parts can be manufactured in accordance with performance and cost objectives
8.Provide on-job training (OJT) for other engineers

Qualifications

1.Engineering background with thermal designs and/or RF system designs coupled with solid engineering skills
2.Minimum of 12 years related engineering experience with a Bachelor¡¯s degree; or 8 years and a Master¡¯s degree; or a PhD with 5 years¡¯ experience; or equivalent experience
3.Extremely knowledgeable using 3D-CAD tools, strong hands-on experimental and design capability
4.Excellent presentation skills; present progress on large cross-functional initiatives at executive-level meetings
5.Strong skills and experiences in problem solving, time and priority management, communication, and project management

Preferred Qualifications

Semiconductor industry experience is not required, but a plus.

  • ΢ÐŹ«ÖÚºÅ
COPYRIGHT 2022 Íؾ£¿Æ¼¼¹É·ÝÓÐÏÞ¹«Ë¾ All RIGHTS RESERVED. ÁÉICP±¸05007152ºÅ-1
ÍøÕ¾µØͼ